51. Forming Via Holes in A Multilevel Substrate in a Single Step
Inventor(s): Nalin Kuma
Patent # 5,227,013 Filed 7/25/91 Issued 7/13/93

52. Field Emitter Device With Diamond Emission Tips
Inventor (s): Nalin Kumar 
Patent # 5,199,918 Filed: 11/7/91 Issued: 4/6/93

53. Applying A Compound Of A Metal And A Gas Onto A Surface
Inventor(s): Nalin Kuma
Patent # 5,196,102 Filed 8/8/91 Issued 3/23/93

54. Cylindrical Hollow Cathode Magnetron Sputtering System
Inventor(s): Nalin Kumar 
Patent # 5,178,743 Filed 1/30/91 Issued 1/12/93

55. Diffusion Barrier For Copper Features
Inventor(s): Nalin Kumar 
Patent # 5,164,332 Filed 3/15/91 Issued 11 /17/92

56. Semiconductor Bonding Bumps Using Metal Cluster Ion Deposition
Inventor(s): Nalin Kumar, Rao Goruganthu and Mohammed Ghazi 
Patent # 5,156,997 Filed 2/11/91 Issued 10/20/92

57. Electrical Components in High Density Substrates
Inventor(s): Nalin Kuma
Patent # 5,120,572 Filed 10/30/90 Issued 06/09/92

58. Multilayer Electrical Interconnect Fabrication, Few Process Steps
Inventor(s): Nalin Kumar and Charles Lin 
Patent # 5,118,385 Filed 05/28/91 Issued 06/02/92

Nalin Kumar
Patent Portfolio Summary (7/1/2003)
Mobile Website Builder